Tessolve, participating as a Platinum Sponsor, will be there at the Leela Palace, Bengaluru, between July 21-23, attending the International Test Conference 2019. The event, hosting industry experts, will focus on the challenges in the test engineering, combined efforts to address them, and the latest technologies in the field.
As a Platinum Sponsor, Tessolve will highlight the progress made by its team of in-house design, test, and yield professionals, ready to collaborate and ideate new solutions for tomorrow’s test engineering processes.
Speaking about today’s testing challenges, the team will also conduct a tutorial session titled, ‘Challenges and Best Practices on ATE Load Board Design’ prior to the conference on July 21.
To know more about the event and participate, visit the following link – https://itctestweekindia.org/
International Test Conference India 2019
July 21-23, 2019
The Leela Palace
Bengaluru, India
