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Lost in the advanced IC packaging labyrinth? Know these 10 basic terms

By October 1, 2020September 23rd, 2022No Comments

When chip scaling is becoming more difficult and expensive at each node, engineers are putting multiple chips in advanced packages as an alternative to chip scaling.

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Find out how Tessolve Hardware Verification services help to meet the challenging requirements with respect to performance, flexibility and verify today’s complex designs effectively.

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