Partnership Overview
About the program and our offerings
About Connect Partner Program
NXP’s Connect Partner Program is a global network of independent engineering solution companies to speed up Client’s design.
What We Are Offering
As an NXP program partner, we offer product engineering services & solutions including design, development, regulatory qualifications, manufacturing, and post-manufacturing product life cycle support.
Our Differentiator
In-house developed a family of systems on modules “MAGIK-2” based on SMARC & Q7 standard using I.MX6 and I.MX8 processor offering Linux & Android software SDK, backed with our own EVK boards which help customers accelerate the product development cycle.
Focus On Hardware
Embedded board solutions for the NXP Program
i.MX6 SOM Boards
i.MX6 SMARC & Q7 SOM boards supporting Linux & Android SDK with BSP, Middleware & UI (Qt/Android) support.
i.MX6 SOM Boards
i.MX6 SMARC & Q7 SOM boards supporting Linux & Android SDK with BSP, Middleware & UI (Qt/Android) support.
S32G2 SMARC SOM
Tessolve introduces a SMARC 2.1 SoM (System-on-Module) based on S32G2 CPU a high-performance vehicle network processor.
More On The Modules Here
Download Datasheets
M2-SM8M-xx – i.MX8M based SMARC Module
Using the SMARC standard 2.0 for embedded modules, TESSOLVE EMBEDDED SYSTEMS introduces an ultra-low..
M2-SM6-xx – i.MX6 based SMARC Modules
Using the new SMARC standard for embedded modules, Tessolve Embedded Systems introduces a series of ..
M2-Q7M6-xx – i.MX6 based QSeven Modules
Using the QSeven standard for embedded modules, Tessolve Embedded Systems introduces a series of ult..
NXP S32G2 SMARC SoM
Tessolve introduces a SMARC 2.1 SoM (System-on-Module) based on the NXP S32G2 CPU a high-performance..
