Tessolve was the Platinum sponsor for the largest event on ESDM in South Asia – the IESA Vision Summit 2019, playing a part in crafting the country’s role in tomorrow’s electronic systems. The event was held at the Leela Palace, Bengaluru, on 19th & 20th of Feb 2019.
In the assemblage of leading OEM and Electronic Systems providers, our Founder & CEO, Mr.Raja Manickam shared his thoughts at the IESA conference. He spoke about the best practices of Chip Development and the ideal steps to building and nurturing promising Startups.
Off the stage, our team also had insightful interactions at the booth, showcasing our capabilities of innovating tomorrow’s electronic system. Besides this, they spoke about advanced engineering for Robotics & AI as key stakeholders from various companies visited the stall. Here, live demos from our key engineering teams highlighted embedded products, system developments, and board fabrications from our FA & Reliability Lab.
Overall our team had an amazing time and fruitful interactions on product engineering and electronic systems. The event, a great opportunity for us to establish new contacts and build rapport with our customers, was also the platform to highlight Tessolve’s 15 Years of Engineering success.
