Very glad to share that following three papers which got selected were presented by our team member at the TUG (Teradyne User Group) CONFERENCE CHINA, last week. The papers were well received and appreciated by everyone. We are also very happy to share that Vijay Anand’s paper won the Best Paper award in the DIB DESIGN category.
1) Adaptive RF-DIB for ATE and Bench Reducing NRE-cost and Cycle Time, in RF / Wireless category, by
Gowri Shankar Ilankumaran, Sr. Test Engineer 1, Bangalore
C Srinivasan, Sr. Manager – Test Engineering, Bangalore
Jagadish Kumar Chandrasekaran, Director – Test Engineering, Bangalore
2) Novel DIB Layout Solution to Minimize Load Capacitance in pico-Amps Measurement, in DIB Design category, by
Siva Pavan Anala, Test Lead, Bangalore
Jagadish Kumar Chandrasekaran, Director – Test Engineering, Bangalore
3) Choosing the right PCB Stackup technology for your Teradyne Ultraflex Test Boards, in DIB Design category, by
Vijay N, Director – PCB Design, Coimbatore
